MIRO 

FM Thermal Vacuum Test Plan 

 

 

 

 

 

 

Prepared by 

 

 

C. Kahn 

 

Approved by: 

 

 

Margaret A. Frerking 

MIRO Project Manager 

 

 




 

DOCUMENT CHANGE LOG 

 

 

CHANGE 

NUMBER 

CHANGE 
DATE 

PAGES 
AFFECTED 

CHANGES/ 

NOTES 

GENERAL 

COMMENTS 

1 

20 Apr 2001 

All 

DRAFT 

 

2 

24 April 2001 

All 

Issue 1, Rev 0 

 

3 

2 May 2001 

10 

Issue 1, Rev 1 

Corrected Max Non-op 
test temperature 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 



 

 




 

 

 

 

 

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CONTENTS 

 

1 Objectives.......................................................................................................................7 
2 Conditions......................................................................................................................7 
2.1 Applicable Documents.............................................................................................7 
2.2 Hazards and Precautions.........................................................................................7 
2.3 Personnel and Responsibilities................................................................................7 
2.4 Handling of Flight Hardware.....................................................................................8 
3 Limited Functional Test Definition for Thermal Vacuum..................................................8 
4 Thermal Vacuum Test Requirements..............................................................................9 
4.1 Thermal Vacuum Test Profile...................................................................................9 
4.2 Temperature Reference Points, Ranges and Spacecraft Sensor Placement..........9 
4.3 Temperature Rate of Change................................................................................12 
4.4 Thermal Cycles......................................................................................................12 
4.5 Temperature Stabilization and Duration for Thermal Cycles.................................12 
4.6 Vacuum Level........................................................................................................12 
4.7 Test Set Up............................................................................................................13 
4.8 Test Facility............................................................................................................13 
5 Data Handling................................................................................................................13 
5.1 Data Acquisition.....................................................................................................13 
5.2 Data reduction........................................................................................................13 
5.3 Data archiving........................................................................................................14 
6 Test Sequence..............................................................................................................14 
6.1 Detailed Test Sequence.........................................................................................14 
6.2 Description of Functional and Calibration Tests.....................................................15 
6.2.1 Functional Tests..............................................................................................15 
6.2.2 Calibration Tests.............................................................................................16 
7 Quality Assurance.........................................................................................................16 
APPENDIX A MIRO Housekeeping Variables...................................................................17 
APPENDIX B Ancillary Temperature Monitoring................................................................20 
APPENDIX C Environmental Test Facility Temperature Monitoring..................................24 
List of Figures 

 

Figure 1 Thermal/Vacuum Test Profile.................................................................................10 
Figure 2 Sensor Backend Electronics Unit Temperature Reference Point..........................11 
Figure 3 Sensor Unit Temperature Reference Point...........................................................11 
Figure 4 MIRO Temperature Sensor Locations...................................................................19 
Figure 5 MIRO Ancillary Temperature Monitoring Points....................................................23 
Figure 6 Environmental Test Facility Temperature Monitoring Points.................................25 


 




List of Tables 

 

Table 1 Temperature Reference Points.................................................................................9 
Table 2 Temperature Ranges..............................................................................................12 
Table 3 Yellow and Red Alarm Limits for Internal MIRO Variables.....................................17 
Table 4 Ancillary Temperature Monitoring, Instrument Power OFF....................................20 
Table 5 Ancillary Temperature Monitoring, Instrument Power ON......................................20 
Table 6 Temperature Monitoring Points by the ETL Facility................................................24 



Acronyms 

 

 

AMP Amplifier 

Ana Analog 

Bd Board 

C Centigrade 

Cal Calibration 

Curr Current 

Deg degrees 

DET Detector 

ECal Electronics Unit Calibration 

EID-B Experiment Interface Document, Part B 

EQM Electrical Qualification Model 

ERR Error 

EU Electronics Unit 

FS1 Frequency Synthesizer 1 (2182 MHz) 

FS2 Frequency Synthesizer 2 (7147 MHz) 

FS3 Frequency Synthesizer 3 (7728 MHz) 

IF Intermediate Frequency 

IFP Intermediate Frequency Processor 

LFT Limited Functional Test 

LO Local Oscillator 

MIRO Microwave Instrument for the Rosetta Orbiter 

MM Millimeter 

Mult Multiplier 

OB Optical Bench 

PLL Phase Lock Loop 

Pwr Power 

RF Radio Frequency 

SBEU Sensor Backend Electronics Unit 

Sen_El Sensor Electronics 

SMM Submillimeter 

Spect Spectrometer 

Temp Temperature 

TLM Telemetry 

TRP Temperature Reference Point 

V Voltage 

 

 




1 Objectives 


 

The objectives of the MIRO FM thermal vacuum tests are to: 

 

* Test the instrument at the extremes of the temperature limits for non-operating and 
operating conditions in representative instrument modes 
* Verify the functional operation of the instrument under temperature and vacuum 
conditions 
* Measure the power (steady state and peak) at the spacecraft interface 
* Calibrate the flight instrument 


 

2 Conditions 
2.1 Applicable Documents 




 

The following documents of the latest issue in effect on the date of testing shall form a part of 
this plan to the extent specified herein. In the event that this document is found to be in 
conflict with any of the reference documents, then the Test Director shall be consulted. 

 

10174190 FM Sensor Unit Main Assembly JPL Dwg. 

10174400 FM Sensor Backend Electronics Unit Main Assembly JPL Dwg. 

10174700 FM Electronics Unit Assembly JPL Dwg. 

10174201 MICD, Sensor Unit 

10174210 MICD, Sensor Backend Electronics Unit 

10174701 MICD, Electronics Unit 

10175001 MICD, Ultrastable Oscillator 

 

RO-EST-RS-30001/EID A Rosetta Experiment Interface Document, Part A 

 

MIL-STD-45662 Calibration System requirements 

 

2.2 Hazards and Precautions 


 

All personnel shall be alerted for conditions, which may endanger the staff conducting the 
test or the equipment being tested. Any conditions, which appear hazardous, shall be 
brought to the attention of the test conductor. 

 

2.3 Personnel and Responsibilities 


 

The following personnel, or appropriate alternates, shall be present to conduct, or observe, 




or be on call during the tests as required. 

 

MIRO Integration and Test Project Element Manager (PEM): Cynthia Kahn 

PEM is to provide the necessary procedures and staff for assembling and handling of the FM 
hardware during the test and is responsible for the safety of the hardware at all times. PEM and the 
Test Director shall certify that all test objectives have been met prior to tear down. 

 

Test Director (TD): Cynthia Kahn/Ali Pourangi 

TD shall assure compliance with the Test Plan and certify that all the test objectives have been met. 
TD is responsible for all thermal and functional assessment and shall prepare the Test Plan in 
conformity with the project environmental requirements. S/He is also responsible for preparing a final 
Test Report documenting the results of the Tests. 

 

Science Calibration Lead (SCL): Dr. Samuel Gulkis 

SCL shall be responsible for the preparation of the detailed Calibration Procedure, real-time calibration 
test data acquisition, processing, recording and data reduction and preparation of a test report. 

 

Quality Assurance Representative (QAR): Jim Aragon 

Quality Assurance will be present at all times to monitor compliance with test procedures and to 
witness successful completion of the tests. 

 

2.4 Handling of Flight Hardware 


 

Only currently certified personnel shall handle MIRO Flight Hardware. Procedures for ESD 
avoidance shall be followed. For hardware safety, the temperature while handling shall be 
room temperature +/- 5 degrees with a minumum of 30% humidity. 

 

The MIRO hardware has been baked out prior to thermal vacuum testing so personnel shall 
wear appropriate clothing (including smocks, hats, face masks, and gloves) while near the 
hardware. Contamination control for MIRO shall be class 100,000. 

 

3 Limited Functional Test Definition for Thermal Vacuum 


 

A Limited Functional Test (LFT) will be performed before, during and after the thermal 
vacuum test, as appropriate, in order to demonstrate that functional capability has not been 
degraded by the environmental test. The Limited Functional Test will demonstrate that the 
performance of selected hardware and software functions is within acceptable limits. 

 




4 Thermal Vacuum Test Requirements 
4.1 Thermal Vacuum Test Profile 




The thermal vacuum test at instrument level shall be performed as defined Figure 1. The 
test is split into two major sections. The first section of the test addresses ESA Rosetta 
Project requirements. The second section of the test provides instrument calibration. Note 
that the shroud temperature will not be controlled during any part of the test. Further 
explanation of the temperature limits, cycles, rate of change and durations are given in the 
following sections as well as a more detailed test sequence. 

 

4.2 Temperature Reference Points, Ranges and Spacecraft Sensor Placement 


 

The temperatures are defined at the spacecraft temperature reference points specified in the 
EID-B document for MIRO. These points are given in Table 1 and the temperature limits are 
given in Table 2. The limits specified for the Sensor Unit correspond to those for the optical 
bench (not the telescope). 

 

Approximate physical sensor placements for the SU and SBEU are shown in Figures 2 and 
3. These correspond to the points identified on MIRO's MICDs. For the EU and USO, 
MIRO will place thermocouples on one of the mounting feet of each unit to monitor the 
temperature as close to the spacecraft identified monitoring point as possible. Note: 
Sensors for the EU and USO cannot be placed near the mounting foot because they would 
be on the heat exchanger plate used to control the each unit's temperature. 

 

 

Table 1 Temperature Reference Points 

 

Unit 

Reference Point 

Sensor Unit 

Middle of Optical Bench 

Sensor Backend Electronics Unit 

Mounting Foot 

Electronics Unit 

Near a Mounting Foot 

Ultrastable Oscillator 

Near a Mounting Foot 



 

All flight internal temperature sensors are identified in Appendix A along with their yellow and 
red alarm limits. They are read out through the instrument telemetry. Additional sense 
points, including the spacecraft temperature sensor points, that are monitored by a separate 
MIRO GSE computer are identified in Appendix B. Temperatures monitored independently 
by the Environmental Test Facility are listed in Appendix C. Figures 4, 5, and 6 showing all 
temperature sensor locations are also in the appendices.




 

 MIRO Date: 2-May-2001 Page: 10 
-40-30-20-100102030405060700.01.02.03.04.05.06.07.08.09.010.011.012.013.014.015.016.017.018.019.020.021.022.023.024.025.026.027.028.029.00.0Time (days)
Optical BenchElectronicsTurn Instrument Power ONTurn Instrument Power OFFcycle 1cycle 2cycle 3cycle 4calibration
Figure 1 Thermal/Vacuum Test Profile 

 

 




 

 

Figure 2 Sensor Backend Electronics Unit Temperature Reference Point 

 

 

 


 

 

Figure 3 Sensor Unit Temperature Reference Point 

Text Box: = Temperature Reference PointText Box: = Temperature Reference Point



 

 

 

Table 2 Temperature Ranges 

 

Unit 

Non-Operating Range 

Operating Range 

 

Min 

Max 

Min 

Max 

Sensor Unit 

- 30 o C 

+ 60 o C 

- 20 o C 

+ 40 o C 

Sensor Backend 
Electronics Unit 

- 30 o C 

+ 60 o C 

- 20 o C 

+ 55 o C 

Electronics Unit 

- 30 o C 

+ 60 o C 

- 20 o C 

+ 55 o C 

Ultrastable Oscillator 

- 30 o C 

+ 60 o C 

- 20 o C 

+ 55 o C 



 

The temperature tolerances are: 

 

For the maximum Temperature: +3/-0 deg C 

For the minimum Temperature: +0/-3 deg C 

 

4.3 Temperature Rate of Change 


 

The rate of change will be <= 20 degrees C / hour. 

 

4.4 Thermal Cycles 


The total number of thermal cycles (non-calibration) will be 4. The instrument shall be 
operating during the temperature cycles. 

 

4.5 Temperature Stabilization and Duration for Thermal Cycles 


 

Temperature stabilization is based on the temperature at the temperature reference point. 
Time at test temperature is counted from the end of the stabilization period. 

 

Temperature stabilization is reached when the temperature rate of change at the 
temperature reference point is less than 5 degrees C during a time period of 1 hour. After 
temperature stabilization, the instrument will remain at each extreme of temperature for a 
minimum of 4 hours. 

 

4.6 Vacuum Level 


 




The vacuum during test performance will be <= 7.5 x 10 -6 
Torr (10-3 Pa). 

 

4.7 Test Set Up 


 

The MIRO FM shall be mounted on or connected to heat exchanger plates simulating the 
spacecraft mounting surface and layout. The SU shall be bolted to a vertical section of an 
aluminum adapter plate and thermally strapped to a heat exchanger via thermal braids 
attached to the radiator struts. The SBEU, EU and USO shall be bolted directly to the 
horizontal surface of a heat exchanger. All units shall be mounted in conformance with the 
MICDs identified in Section 2.1 of this document. (See Figure 6 in Appendix C). 

 

To provide appropriate calibration conditions, the following setup will also be in place: 

 

Thermal braids will be attached to the MIRO cold load and attached to a separate thermal 
plate (provided by the Environmental Test Laboratory (ETL, Section 351) for cooling the load 
to < -50 o C. An absorber plate for microwave radiation will be placed in the field of view of 
the telescope. 

 

Temperature monitoring in addition to that discussed in Section 4.2 of this document shall be 
provided by the ETL facility. Monitoring points are defined in Appendix C of this document. 

4.8 Test Facility 


 

Environmental Test Laboratory (Section 351) personnel shall be responsible for the thermal 
vacuum chamber in Building 144, Room 119. 

5 Data Handling 
5.1 Data Acquisition 




 

 

All instrumentation data shall be permanently recorded on disk during the test. 

 

Digital photographs of test set up shall be taken before and after each test. 

 

All pertinent test data shall be retained until their disposition is determined by the MIRO 
Project Office. 

 

5.2 Data reduction 


 




Two types of data reduction shall take place. 

 

The first type of data reduction shall demonstrate compliance with the EID-A requirements. 

 

The Limited Functional Test data shall be analyzed and all the temperature sensor 
and pressure data shall be plotted. 

 

The written Test Report shall present the photographs and plotted test data to 
summarize the tests conducted, the results of all performance obtained, the 
analysis of test data, observations and conclusions of test phase. 

 

The second type of reduction shall cover the science calibration analysis. Details of this 
analysis are given the Calibration Plan. 

5.3 Data archiving 


Data shall be archived on CD-Rs from the EGSE. [Note: It is recommended that gold-on 
gold or gold/silver-on gold CD-Rs be used.] Calibration data shall be archived as described 
in the Calibration Plan. 

6 Test Sequence 
6.1 Detailed Test Sequence 




 

 

The following is the detailed test sequence for the thermal vacuum test. 

 

Day 1 Install in chamber and perform ambient (in air) Limited Functional Test 

 Close chamber door and pumpdown 

 Perform Limited Functional Test in vacuum at ambient temperature 

 Transition to hot non-operational temperature 

 Hot soak after temperature stabilization 

 Transition to hot operational temperature 

Day 2 Test at hot operational temperature 

Day 3 Continue to test at hot operational temperature 

Day 4 Transition to room temperature 

 Test at room temperature 

 Transition to cold non-operational temperature 

Day 5 Cold soak after temperature stabilization 

 Transition to cold operational temperature 

 Test at cold operational temperature 

Day 6 Continue test at cold operational temperature 

Day 7 Continue test at cold operational temperature 

 Start remaining thermal cycles 




Day 8 Continue thermal cycles 

Day 9 Finish thermal cycles 

 Begin calibration 

Day 10 - 19 Calibration 

 Pause calibration at ambient temperature (downward temperature) 

 Perform Limited Functional Test in vacuum at ambient temperature 

Day 20 Break vacuum. 

 Perform ambient (in air) Limited Functional Test 

 Reconfigure instrument and chamber for additional calibration 

Day 21 Perform ambient (in air) Limited Functional Test 

 Close chamber door and pumpdown 

 Perform Limited Functional Test in vacuum at ambient temperature 

 Transition to hot calibration temperature 

Day 21 - 26 Calibration 

Day 27 Finish Calibration 

 Heat to above ambient temperature and drift to ambient 

Day 28 Perform Limited Functional Test in vacuum at ambient temperature 

 Break vacuum. 

 Perform ambient (in air) Limited Functional Test 

 Remove instrument from chamber 

Day 29 - 30 Contingency days 

 

6.2 Description of Functional and Calibration Tests 


Both functional and calibration tests will be performed while MIRO is going through its 
thermal vacuum test profile. Brief description of each are contained below. Detailed 
procedures for accomplishing these tests are contained in the MIRO FM Thermal Vacuum 
Test Procedures document. 

 

6.2.1 Functional Tests 


 

The MIRO FM Thermal Vacuum Procedure (RO-MIR-PR-0054) will be used for the thermal 
vacuum tests. Some post test processing may be required for verification. Examples of the 
test types are listed below. 

 

* Functional Tests 
* Telemetry output verification 
* Command input verification 
* Calibration mechanism movement 
* Continuum and /or Spectral data received, as appropriate for each power mode 
* Power application on redundant interface circuit 
* Data receipt on redundant interface circuit 
* Measurements: 





* Total power draw in each power mode 
* Total current draw in each power mode 
* Temperature of all units in non-operational state at the TRP in each power mode 
* Temperature of all units in operational state(s) at the TRP in each power mode 
6.2.2 Calibration Tests 




 

 

 

The MIRO Calibration Plan (RO-MIR-PL-0025) contains a description of all calibrations to be 
performed for the MIRO instrument. The MIRO FM Thermal Vacuum Calibration Test 
Procedure (RO-MIR-PR-xxxx) will be followed. 

 

7 Quality Assurance 


 

Quality Assurance personnel shall be required to witness test preparation, installation in the 
chamber, changes to cabling during the chamber break, and removal of the instrument from 
the chamber. All instrumentation data shall be recorded to document the environment the 
hardware is exposed to. Assembly and Inspection Data sheets shall be used to document 
the test setup and shall become part of the data package for future reference. 

 

 

 




APPENDIX A MIRO Housekeeping Variables 

 

Table 3 Yellow and Red Alarm Limits for Internal MIRO Variables 

 

ChannelNumber 

Variable Name 

Description 

Units

Yel_lo 

Yel_hi 

Red_lo 

Red_hi 

 

 

 

 

 

 

 

 

0 

Spect_T1 

CTS 

C 

-20 

70 

-25 

75 

1 

Spect_T2 

CTS 

C 

-20 

70 

-25 

75 

2 

Spect_T3 

CTS 

C 

-20 

70 

-25 

75 

3 

Spect_T4 

CTS 

C 

-20 

70 

-25 

75 

4 

Spect_T5 

CTS 

C 

-20 

65 

-25 

70 

5 

Spect_T6 

CTS 

C 

-20 

65 

-25 

70 

6 

EU_Temp 

Temp - EU Pwr Bd 

C 

-20 

55 

-25 

65 

7 

ECal_Temp 

Temp Circuit Monitor 

DN 

3295 

3335 

3285 

3345 

8 

+5V_EU 

EU +5 Voltage 

V 

4.7 

5.3 

4.5 

5.5 

9 

+12V_ EU 

EU +12 Voltage 

V 

11.5 

12.5 

11 

13 

10 

-12V_ EU 

EU -12 Voltage 

V 

-12.5 

-11.5 

-13 

-11 

11 

+3.3V_ EU 

EU +3.3 Voltage 

V 

3.1 

3.5 

2.9 

3.7 

12 

+24V_ EU 

EU +24 Voltage 

V 

23 

25 

22 

27 

13 

+5VAna_ EU 

EU +5 Analog Voltage 

V 

4.7 

5.3 

4.5 

5.5 

14 

+5V_Curr_EU 

EU +5 Current 

A 

0.1 

3 

0 

3.3 

15 

+12V_Curr_EU 

EU +12 Current 

A 

0.1 

0.8 

0 

0.9 

16 

-12V_Curr_EU 

EU -12 Current 

A 

0.01 

0.11 

0 

0.113 

17 

+24VAna_Curr_EU 

EU +24 Current 

A 

0.1 

0.8 

0 

0.83 

18 

+3.3V_Curr_EU 

EU +3.3 Current 

A 

0.1 

2 

0 

3 

19 

+5VAna_Curr_EU 

EU +5 Analog Current 

A 

0.1 

0.8 

0 

1 

20 

TLM_Heating 

USO Heater Voltage 

V 

1 

2.2 

0 

4.9 

21 

TLM_RF 

USO RF Voltage 

V 

1.5 

4.5 

0 

4.9 

22 

CTS_V_Ana_1 

CTS 

V 

2.45 

2.6 

2.4 

2.65 

23 

CTS_V_Ana_2 

CTS 

V 

2.45 

2.6 

2.4 

2.65 

24 

Cold_Load1_Temp 

Temp 1 - Cold Load 

C 

-100 

50 

-120 

60 

25 

Cold_Load2_Temp 

Temp 2 - Cold Load 

C 

-100 

50 

-120 

60 

26 

Warm_Load1_Temp 

Temp 1 - Warm Load 

C 

-20 

55 

-25 

60 

27 

OB_Temp 

Temp - Optical Bench 

C 

-20 

35 

-25 

40 

28* 

Telescope1 

Temp - Primary 

C 

-100 

50 

-120 

60 

29* 

Telescope2 

Temp - Secondary 

C 

-100 

50 

-120 

60 

30 

PLL_Temp 

Temp - PLL 

C 

-20 

55 

-25 

60 

31 

IFP_DET_Temp 

Temp - IFP Detector 

C 

-20 

55 

-25 

60 

32 

IFP_AMP_Temp 

Temp - IFP Amplifier 

C 

-20 

55 

-25 

60 

33 

SMM_LO_GUNN 

Temp - SMM Gunn 

C 

-20 

45 

-25 

65 

34 

MM_LO_GUNN 

Temp - MM Gunn 

C 

-20 

35 

-25 

45 

35 

Motor_Temp 

Temp - Cal Motor 

C 

-20 

100 

-25 

120 

36 

Sen_El 

Temp - SU Pwr Bd 

C 

-20 

55 

-25 

60 

37 

Warm_Load2_Temp 

Temp 2 - Warm Load 

C 

-20 

55 

-25 

60 

38 

Cal_Temp_Low 

Load Circuit Monitor 

DN 

440 

500 

430 

560 

39 

Cal_Temp_High 

Load Circuit Monitor 

DN 

3700 

3850 

3650 

3900 

40 

+5V_SBEU 

SBEU +5 Voltage 

V 

4.7 

5.3 

4.5 

5.5 

41 

+12V_1_SBEU 

SBEU +12 Voltage 

V 

11 

12.5 

10.8 

13 






42 

+12V_2_ SBEU 

SBEU +12 S Voltage 

V 

11.5 

12.5 

11 

13 

43 

-12V_ SBEU 

SBEU -12 T Voltage 

V 

-12.5 

-10.8 

-13 

-10.3 

44 

+5V_Curr_ SBEU 

SBEU +5 Current 

A 

0.45 

0.6 

.05 

0.7 

45 

+12V_Curr _1_ SBEU 

SBEU +12 T Current 

A 

0.125 

0.5 

.05 

0.6 

46 

+12V_Curr _2_ SBEU 

SBEU +12 S Current 

A 

0.7 

0.8 

0.25 

0.85 

47 

-12V_Curr _ SBEU 

SBEU -12 Current 

A 

0.125 

0.2 

0.05 

.25 

48 

MM_GUNN_Curr 

MM Gunn Current 

mA 

150 

160 

145 

165 

49 

SMM_Mult_Curr 

SMM Multiplier Current 

mA 

0 

3 

0 

5 

50 

SMM_PLL_ERR 

Smm PLL Phase Error 

V 

1.5 

2.75 

1.25 

3.0 

51 

FS1_ERR 

FS1 Phase Error -2182 

V 

1.0 

3.5 

0.5 

4.0 

52 

FS2_ERR 

FS2 Phase Error -7147 

V 

1.0 

3.5 

0.5 

4.0 

53 

FS3_ERR 

FS3 Phase Error -7728 

V 

1.0 

3.5 

0.5 

4.0 

54 

SMM_PLL_GUNN_Curr 

SMM Gunn Current 

mA 

150 

160 

145 

165 

55 

SMM_PLL_IF_PWR 

PLL IF Power 

V 

8.2 

9.3 

8.0 

9.5 



 

 




 

Figure 4 MIRO Temperature Sensor Locations 

 

 

Text Box: 


APPENDIX B Ancillary Temperature Monitoring 

 

Table 4 Ancillary Temperature Monitoring, Instrument Power OFF 

 

Channel 

Thermocouple Name 

Units 

Yel_lo 

Yel_hi 

Red_lo 

Red_hi 

 

 

 

 

 

 

 

1 

Optical Bench 

C 

-25.0 

+55.0 

-28.0 

+58.0 

2 

SBEU Electronics Interface 

C 

-25.0 

+55.0 

-28.0 

+58.0 

3 

EU Electronics Interface 

C 

-25.0 

+55.0 

-28.0 

+58.0 

4 

USO Interface 

C 

-25.0 

+55.0 

-28.0 

+58.0 

5 

SBEU A1, Triple Supply * 

C 

-25.0 

+55.0 

-28.0 

+58.0 

6 

SBEU A2, +12 Power Supply 

C 

-25.0 

+55.0 

-28.0 

+58.0 

7 

SBEU U23, -5V Regulator 

C 

-25.0 

+55.0 

-28.0 

+58.0 

8 

SBEU U5, Gunn Bias 

C 

-25.0 

+55.0 

-28.0 

+58.0 

9 

SBEU U8, LNA Bias 

C 

-25.0 

+55.0 

-28.0 

+58.0 

10 

EU-A A1, 24V &5V Regulator 

C 

-25.0 

+55.0 

-28.0 

+58.0 

11 

EU-A A2, +/-12V & 5V Regulator 

C 

-25.0 

+55.0 

-28.0 

+58.0 

12 

mm RFE LNA 

C 

-25.0 

+55.0 

-28.0 

+58.0 

13 

submm RFE LNA 

C 

-25.0 

+55.0 

-28.0 

+58.0 

 

 

 

 

 

 

 



 

 

Table 5 Ancillary Temperature Monitoring, Instrument Power ON 

 

Channel 

Thermocouple Name 

Units 

Yel_lo 

Yel_hi 

Red_lo 

Red_hi 

 

 

 

 

 

 

 

1 

Optical Bench 

C 

-15.0 

+35.0 

-18.0 

+38.0 

2 

SBEU Electronics Interface 

C 

-15.0 

+50.0 

-18.0 

+53.0 

3 

EU Electronics Interface 

C 

-15.0 

+50.0 

-18.0 

+53.0 

4 

USO Interface 

C 

-15.0 

+50.0 

-18.0 

+53.0 

5 

SBEU A1, Triple Supply * 

C 

-15.0 

+90.0 

-18.0 

+100.0 

6 

SBEU A2, +12 Power Supply 

C 

-15.0 

+90.0 

-18.0 

+100.0 

7 

SBEU U23, -5V Regulator 

C 

-15.0 

+90.0 

-18.0 

+100.0 

8 

SBEU U5, Gunn Bias 

C 

-15.0 

+90.0 

-18.0 

+100.0 

9 

SBEU U8, LNA Bias 

C 

-15.0 

+90.0 

-18.0 

+100.0 

10 

EU-A A1, 24V &5V Regulator 

C 

-15.0 

+90.0 

-18.0 

+100.0 

11 

EU-A A2, +/-12V & 5V Regulator 

C 

-15.0 

+90.0 

-18.0 

+100.0 

12 

mm RFE LNA 

C 

-15.0 

+45.0 

-18.0 

+55.0 

13 

submm RFE LNA 

C 

-15.0 

+55.0 

-18.0 

+60.0 

 

 

 

 

 

 

 






 




 

 

 

 

Figure 5 MIRO Ancillary Temperature Monitoring Points 

 


Text Box: Channels 12 - 13Text Box: Channels 5 - 9Text Box: Channels 10 - 11Text Box: Channel 3Text Box: Channel 4Text Box: Channel 2Text Box: Channel 1



 

APPENDIX C Environmental Test Facility Temperature Monitoring 

 

Table 6 Temperature Monitoring Points by the ETL Facility 

 

Channel 

Thermocouple Name 

Units 

Yel_lo 

Yel_hi 

Red_lo 

Red_hi 

 

 

 

 

 

 

 

1 

Large Thermal Plate 

C 

-100 

80 

-110 

90 

2 

Small Thermal Plate 

C 

-100 

80 

-110 

90 

3 

Cold Load Thermal Plate 

C 

-100 

-50 

-110 

-40 

4 

Target Temp 1 (Center) 

C 

-25.0 

+55.0 

-30.0 

+60.0 

5 

Target Temp 2 (UR Corner) 

C 

-25.0 

+55.0 

-30.0 

+60.0 

6 

Target Temp 3 (UL Corner) 

C 

-25.0 

+55.0 

-30.0 

+60.0 

7 

Target Temp 4 (LR Corner) 

C 

-25.0 

+55.0 

-30.0 

+60.0 

8 

Target Temp 5 (LL Corner) 

C 

-25.0 

+55.0 

-30.0 

+60.0 

9 

Optical Bench 

C 

-25.0 

+55.0 

-28.0 

+58.0 

10 

SBEU Electronics Interface 

C 

-25.0 

+55.0 

-28.0 

+58.0 

11 

EU Electronics Interface 

C 

-25.0 

+55.0 

-28.0 

+58.0 

12 

USO Interface 

C 

-25.0 

+55.0 

-28.0 

+58.0 



 

 




 

 

Figure 6 Environmental Test Facility Temperature Monitoring Points 

 


Text Box: Chamber DoorText Box: Cold Load Thermal PlateText Box: Small Thermal PlateText Box: Large Thermal PlateText Box: Channel 7 - 8Text Box: Channel 5 - 6Text Box: Channel 4Text Box: Channel 3Text Box: Channel 2Text Box: Channel 1Text Box: Channel 11Text Box: Channel 12Text Box: Channel 10Text Box: Channel 9