MIRO FM Thermal Vacuum Test Plan Prepared by C. Kahn Approved by: Margaret A. Frerking MIRO Project Manager DOCUMENT CHANGE LOG CHANGE NUMBER CHANGE DATE PAGES AFFECTED CHANGES/ NOTES GENERAL COMMENTS 1 20 Apr 2001 All DRAFT 2 24 April 2001 All Issue 1, Rev 0 3 2 May 2001 10 Issue 1, Rev 1 Corrected Max Non-op test temperature [Page left intentionally blank] CONTENTS 1 Objectives.......................................................................................................................7 2 Conditions......................................................................................................................7 2.1 Applicable Documents.............................................................................................7 2.2 Hazards and Precautions.........................................................................................7 2.3 Personnel and Responsibilities................................................................................7 2.4 Handling of Flight Hardware.....................................................................................8 3 Limited Functional Test Definition for Thermal Vacuum..................................................8 4 Thermal Vacuum Test Requirements..............................................................................9 4.1 Thermal Vacuum Test Profile...................................................................................9 4.2 Temperature Reference Points, Ranges and Spacecraft Sensor Placement..........9 4.3 Temperature Rate of Change................................................................................12 4.4 Thermal Cycles......................................................................................................12 4.5 Temperature Stabilization and Duration for Thermal Cycles.................................12 4.6 Vacuum Level........................................................................................................12 4.7 Test Set Up............................................................................................................13 4.8 Test Facility............................................................................................................13 5 Data Handling................................................................................................................13 5.1 Data Acquisition.....................................................................................................13 5.2 Data reduction........................................................................................................13 5.3 Data archiving........................................................................................................14 6 Test Sequence..............................................................................................................14 6.1 Detailed Test Sequence.........................................................................................14 6.2 Description of Functional and Calibration Tests.....................................................15 6.2.1 Functional Tests..............................................................................................15 6.2.2 Calibration Tests.............................................................................................16 7 Quality Assurance.........................................................................................................16 APPENDIX A MIRO Housekeeping Variables...................................................................17 APPENDIX B Ancillary Temperature Monitoring................................................................20 APPENDIX C Environmental Test Facility Temperature Monitoring..................................24 List of Figures Figure 1 Thermal/Vacuum Test Profile.................................................................................10 Figure 2 Sensor Backend Electronics Unit Temperature Reference Point..........................11 Figure 3 Sensor Unit Temperature Reference Point...........................................................11 Figure 4 MIRO Temperature Sensor Locations...................................................................19 Figure 5 MIRO Ancillary Temperature Monitoring Points....................................................23 Figure 6 Environmental Test Facility Temperature Monitoring Points.................................25 List of Tables Table 1 Temperature Reference Points.................................................................................9 Table 2 Temperature Ranges..............................................................................................12 Table 3 Yellow and Red Alarm Limits for Internal MIRO Variables.....................................17 Table 4 Ancillary Temperature Monitoring, Instrument Power OFF....................................20 Table 5 Ancillary Temperature Monitoring, Instrument Power ON......................................20 Table 6 Temperature Monitoring Points by the ETL Facility................................................24 Acronyms AMP Amplifier Ana Analog Bd Board C Centigrade Cal Calibration Curr Current Deg degrees DET Detector ECal Electronics Unit Calibration EID-B Experiment Interface Document, Part B EQM Electrical Qualification Model ERR Error EU Electronics Unit FS1 Frequency Synthesizer 1 (2182 MHz) FS2 Frequency Synthesizer 2 (7147 MHz) FS3 Frequency Synthesizer 3 (7728 MHz) IF Intermediate Frequency IFP Intermediate Frequency Processor LFT Limited Functional Test LO Local Oscillator MIRO Microwave Instrument for the Rosetta Orbiter MM Millimeter Mult Multiplier OB Optical Bench PLL Phase Lock Loop Pwr Power RF Radio Frequency SBEU Sensor Backend Electronics Unit Sen_El Sensor Electronics SMM Submillimeter Spect Spectrometer Temp Temperature TLM Telemetry TRP Temperature Reference Point V Voltage 1 Objectives The objectives of the MIRO FM thermal vacuum tests are to: * Test the instrument at the extremes of the temperature limits for non-operating and operating conditions in representative instrument modes * Verify the functional operation of the instrument under temperature and vacuum conditions * Measure the power (steady state and peak) at the spacecraft interface * Calibrate the flight instrument 2 Conditions 2.1 Applicable Documents The following documents of the latest issue in effect on the date of testing shall form a part of this plan to the extent specified herein. In the event that this document is found to be in conflict with any of the reference documents, then the Test Director shall be consulted. 10174190 FM Sensor Unit Main Assembly JPL Dwg. 10174400 FM Sensor Backend Electronics Unit Main Assembly JPL Dwg. 10174700 FM Electronics Unit Assembly JPL Dwg. 10174201 MICD, Sensor Unit 10174210 MICD, Sensor Backend Electronics Unit 10174701 MICD, Electronics Unit 10175001 MICD, Ultrastable Oscillator RO-EST-RS-30001/EID A Rosetta Experiment Interface Document, Part A MIL-STD-45662 Calibration System requirements 2.2 Hazards and Precautions All personnel shall be alerted for conditions, which may endanger the staff conducting the test or the equipment being tested. Any conditions, which appear hazardous, shall be brought to the attention of the test conductor. 2.3 Personnel and Responsibilities The following personnel, or appropriate alternates, shall be present to conduct, or observe, or be on call during the tests as required. MIRO Integration and Test Project Element Manager (PEM): Cynthia Kahn PEM is to provide the necessary procedures and staff for assembling and handling of the FM hardware during the test and is responsible for the safety of the hardware at all times. PEM and the Test Director shall certify that all test objectives have been met prior to tear down. Test Director (TD): Cynthia Kahn/Ali Pourangi TD shall assure compliance with the Test Plan and certify that all the test objectives have been met. TD is responsible for all thermal and functional assessment and shall prepare the Test Plan in conformity with the project environmental requirements. S/He is also responsible for preparing a final Test Report documenting the results of the Tests. Science Calibration Lead (SCL): Dr. Samuel Gulkis SCL shall be responsible for the preparation of the detailed Calibration Procedure, real-time calibration test data acquisition, processing, recording and data reduction and preparation of a test report. Quality Assurance Representative (QAR): Jim Aragon Quality Assurance will be present at all times to monitor compliance with test procedures and to witness successful completion of the tests. 2.4 Handling of Flight Hardware Only currently certified personnel shall handle MIRO Flight Hardware. Procedures for ESD avoidance shall be followed. For hardware safety, the temperature while handling shall be room temperature +/- 5 degrees with a minumum of 30% humidity. The MIRO hardware has been baked out prior to thermal vacuum testing so personnel shall wear appropriate clothing (including smocks, hats, face masks, and gloves) while near the hardware. Contamination control for MIRO shall be class 100,000. 3 Limited Functional Test Definition for Thermal Vacuum A Limited Functional Test (LFT) will be performed before, during and after the thermal vacuum test, as appropriate, in order to demonstrate that functional capability has not been degraded by the environmental test. The Limited Functional Test will demonstrate that the performance of selected hardware and software functions is within acceptable limits. 4 Thermal Vacuum Test Requirements 4.1 Thermal Vacuum Test Profile The thermal vacuum test at instrument level shall be performed as defined Figure 1. The test is split into two major sections. The first section of the test addresses ESA Rosetta Project requirements. The second section of the test provides instrument calibration. Note that the shroud temperature will not be controlled during any part of the test. Further explanation of the temperature limits, cycles, rate of change and durations are given in the following sections as well as a more detailed test sequence. 4.2 Temperature Reference Points, Ranges and Spacecraft Sensor Placement The temperatures are defined at the spacecraft temperature reference points specified in the EID-B document for MIRO. These points are given in Table 1 and the temperature limits are given in Table 2. The limits specified for the Sensor Unit correspond to those for the optical bench (not the telescope). Approximate physical sensor placements for the SU and SBEU are shown in Figures 2 and 3. These correspond to the points identified on MIRO's MICDs. For the EU and USO, MIRO will place thermocouples on one of the mounting feet of each unit to monitor the temperature as close to the spacecraft identified monitoring point as possible. Note: Sensors for the EU and USO cannot be placed near the mounting foot because they would be on the heat exchanger plate used to control the each unit's temperature. Table 1 Temperature Reference Points Unit Reference Point Sensor Unit Middle of Optical Bench Sensor Backend Electronics Unit Mounting Foot Electronics Unit Near a Mounting Foot Ultrastable Oscillator Near a Mounting Foot All flight internal temperature sensors are identified in Appendix A along with their yellow and red alarm limits. They are read out through the instrument telemetry. Additional sense points, including the spacecraft temperature sensor points, that are monitored by a separate MIRO GSE computer are identified in Appendix B. Temperatures monitored independently by the Environmental Test Facility are listed in Appendix C. Figures 4, 5, and 6 showing all temperature sensor locations are also in the appendices. MIRO Date: 2-May-2001 Page: 10 -40-30-20-100102030405060700.01.02.03.04.05.06.07.08.09.010.011.012.013.014.015.016.017.018.019.020.021.022.023.024.025.026.027.028.029.00.0Time (days) Optical BenchElectronicsTurn Instrument Power ONTurn Instrument Power OFFcycle 1cycle 2cycle 3cycle 4calibration Figure 1 Thermal/Vacuum Test Profile Figure 2 Sensor Backend Electronics Unit Temperature Reference Point Figure 3 Sensor Unit Temperature Reference Point Text Box: = Temperature Reference PointText Box: = Temperature Reference Point Table 2 Temperature Ranges Unit Non-Operating Range Operating Range Min Max Min Max Sensor Unit - 30 o C + 60 o C - 20 o C + 40 o C Sensor Backend Electronics Unit - 30 o C + 60 o C - 20 o C + 55 o C Electronics Unit - 30 o C + 60 o C - 20 o C + 55 o C Ultrastable Oscillator - 30 o C + 60 o C - 20 o C + 55 o C The temperature tolerances are: For the maximum Temperature: +3/-0 deg C For the minimum Temperature: +0/-3 deg C 4.3 Temperature Rate of Change The rate of change will be <= 20 degrees C / hour. 4.4 Thermal Cycles The total number of thermal cycles (non-calibration) will be 4. The instrument shall be operating during the temperature cycles. 4.5 Temperature Stabilization and Duration for Thermal Cycles Temperature stabilization is based on the temperature at the temperature reference point. Time at test temperature is counted from the end of the stabilization period. Temperature stabilization is reached when the temperature rate of change at the temperature reference point is less than 5 degrees C during a time period of 1 hour. After temperature stabilization, the instrument will remain at each extreme of temperature for a minimum of 4 hours. 4.6 Vacuum Level The vacuum during test performance will be <= 7.5 x 10 -6 Torr (10-3 Pa). 4.7 Test Set Up The MIRO FM shall be mounted on or connected to heat exchanger plates simulating the spacecraft mounting surface and layout. The SU shall be bolted to a vertical section of an aluminum adapter plate and thermally strapped to a heat exchanger via thermal braids attached to the radiator struts. The SBEU, EU and USO shall be bolted directly to the horizontal surface of a heat exchanger. All units shall be mounted in conformance with the MICDs identified in Section 2.1 of this document. (See Figure 6 in Appendix C). To provide appropriate calibration conditions, the following setup will also be in place: Thermal braids will be attached to the MIRO cold load and attached to a separate thermal plate (provided by the Environmental Test Laboratory (ETL, Section 351) for cooling the load to < -50 o C. An absorber plate for microwave radiation will be placed in the field of view of the telescope. Temperature monitoring in addition to that discussed in Section 4.2 of this document shall be provided by the ETL facility. Monitoring points are defined in Appendix C of this document. 4.8 Test Facility Environmental Test Laboratory (Section 351) personnel shall be responsible for the thermal vacuum chamber in Building 144, Room 119. 5 Data Handling 5.1 Data Acquisition All instrumentation data shall be permanently recorded on disk during the test. Digital photographs of test set up shall be taken before and after each test. All pertinent test data shall be retained until their disposition is determined by the MIRO Project Office. 5.2 Data reduction Two types of data reduction shall take place. The first type of data reduction shall demonstrate compliance with the EID-A requirements. The Limited Functional Test data shall be analyzed and all the temperature sensor and pressure data shall be plotted. The written Test Report shall present the photographs and plotted test data to summarize the tests conducted, the results of all performance obtained, the analysis of test data, observations and conclusions of test phase. The second type of reduction shall cover the science calibration analysis. Details of this analysis are given the Calibration Plan. 5.3 Data archiving Data shall be archived on CD-Rs from the EGSE. [Note: It is recommended that gold-on gold or gold/silver-on gold CD-Rs be used.] Calibration data shall be archived as described in the Calibration Plan. 6 Test Sequence 6.1 Detailed Test Sequence The following is the detailed test sequence for the thermal vacuum test. Day 1 Install in chamber and perform ambient (in air) Limited Functional Test Close chamber door and pumpdown Perform Limited Functional Test in vacuum at ambient temperature Transition to hot non-operational temperature Hot soak after temperature stabilization Transition to hot operational temperature Day 2 Test at hot operational temperature Day 3 Continue to test at hot operational temperature Day 4 Transition to room temperature Test at room temperature Transition to cold non-operational temperature Day 5 Cold soak after temperature stabilization Transition to cold operational temperature Test at cold operational temperature Day 6 Continue test at cold operational temperature Day 7 Continue test at cold operational temperature Start remaining thermal cycles Day 8 Continue thermal cycles Day 9 Finish thermal cycles Begin calibration Day 10 - 19 Calibration Pause calibration at ambient temperature (downward temperature) Perform Limited Functional Test in vacuum at ambient temperature Day 20 Break vacuum. Perform ambient (in air) Limited Functional Test Reconfigure instrument and chamber for additional calibration Day 21 Perform ambient (in air) Limited Functional Test Close chamber door and pumpdown Perform Limited Functional Test in vacuum at ambient temperature Transition to hot calibration temperature Day 21 - 26 Calibration Day 27 Finish Calibration Heat to above ambient temperature and drift to ambient Day 28 Perform Limited Functional Test in vacuum at ambient temperature Break vacuum. Perform ambient (in air) Limited Functional Test Remove instrument from chamber Day 29 - 30 Contingency days 6.2 Description of Functional and Calibration Tests Both functional and calibration tests will be performed while MIRO is going through its thermal vacuum test profile. Brief description of each are contained below. Detailed procedures for accomplishing these tests are contained in the MIRO FM Thermal Vacuum Test Procedures document. 6.2.1 Functional Tests The MIRO FM Thermal Vacuum Procedure (RO-MIR-PR-0054) will be used for the thermal vacuum tests. Some post test processing may be required for verification. Examples of the test types are listed below. * Functional Tests * Telemetry output verification * Command input verification * Calibration mechanism movement * Continuum and /or Spectral data received, as appropriate for each power mode * Power application on redundant interface circuit * Data receipt on redundant interface circuit * Measurements: * Total power draw in each power mode * Total current draw in each power mode * Temperature of all units in non-operational state at the TRP in each power mode * Temperature of all units in operational state(s) at the TRP in each power mode 6.2.2 Calibration Tests The MIRO Calibration Plan (RO-MIR-PL-0025) contains a description of all calibrations to be performed for the MIRO instrument. The MIRO FM Thermal Vacuum Calibration Test Procedure (RO-MIR-PR-xxxx) will be followed. 7 Quality Assurance Quality Assurance personnel shall be required to witness test preparation, installation in the chamber, changes to cabling during the chamber break, and removal of the instrument from the chamber. All instrumentation data shall be recorded to document the environment the hardware is exposed to. Assembly and Inspection Data sheets shall be used to document the test setup and shall become part of the data package for future reference. APPENDIX A MIRO Housekeeping Variables Table 3 Yellow and Red Alarm Limits for Internal MIRO Variables ChannelNumber Variable Name Description Units Yel_lo Yel_hi Red_lo Red_hi 0 Spect_T1 CTS C -20 70 -25 75 1 Spect_T2 CTS C -20 70 -25 75 2 Spect_T3 CTS C -20 70 -25 75 3 Spect_T4 CTS C -20 70 -25 75 4 Spect_T5 CTS C -20 65 -25 70 5 Spect_T6 CTS C -20 65 -25 70 6 EU_Temp Temp - EU Pwr Bd C -20 55 -25 65 7 ECal_Temp Temp Circuit Monitor DN 3295 3335 3285 3345 8 +5V_EU EU +5 Voltage V 4.7 5.3 4.5 5.5 9 +12V_ EU EU +12 Voltage V 11.5 12.5 11 13 10 -12V_ EU EU -12 Voltage V -12.5 -11.5 -13 -11 11 +3.3V_ EU EU +3.3 Voltage V 3.1 3.5 2.9 3.7 12 +24V_ EU EU +24 Voltage V 23 25 22 27 13 +5VAna_ EU EU +5 Analog Voltage V 4.7 5.3 4.5 5.5 14 +5V_Curr_EU EU +5 Current A 0.1 3 0 3.3 15 +12V_Curr_EU EU +12 Current A 0.1 0.8 0 0.9 16 -12V_Curr_EU EU -12 Current A 0.01 0.11 0 0.113 17 +24VAna_Curr_EU EU +24 Current A 0.1 0.8 0 0.83 18 +3.3V_Curr_EU EU +3.3 Current A 0.1 2 0 3 19 +5VAna_Curr_EU EU +5 Analog Current A 0.1 0.8 0 1 20 TLM_Heating USO Heater Voltage V 1 2.2 0 4.9 21 TLM_RF USO RF Voltage V 1.5 4.5 0 4.9 22 CTS_V_Ana_1 CTS V 2.45 2.6 2.4 2.65 23 CTS_V_Ana_2 CTS V 2.45 2.6 2.4 2.65 24 Cold_Load1_Temp Temp 1 - Cold Load C -100 50 -120 60 25 Cold_Load2_Temp Temp 2 - Cold Load C -100 50 -120 60 26 Warm_Load1_Temp Temp 1 - Warm Load C -20 55 -25 60 27 OB_Temp Temp - Optical Bench C -20 35 -25 40 28* Telescope1 Temp - Primary C -100 50 -120 60 29* Telescope2 Temp - Secondary C -100 50 -120 60 30 PLL_Temp Temp - PLL C -20 55 -25 60 31 IFP_DET_Temp Temp - IFP Detector C -20 55 -25 60 32 IFP_AMP_Temp Temp - IFP Amplifier C -20 55 -25 60 33 SMM_LO_GUNN Temp - SMM Gunn C -20 45 -25 65 34 MM_LO_GUNN Temp - MM Gunn C -20 35 -25 45 35 Motor_Temp Temp - Cal Motor C -20 100 -25 120 36 Sen_El Temp - SU Pwr Bd C -20 55 -25 60 37 Warm_Load2_Temp Temp 2 - Warm Load C -20 55 -25 60 38 Cal_Temp_Low Load Circuit Monitor DN 440 500 430 560 39 Cal_Temp_High Load Circuit Monitor DN 3700 3850 3650 3900 40 +5V_SBEU SBEU +5 Voltage V 4.7 5.3 4.5 5.5 41 +12V_1_SBEU SBEU +12 Voltage V 11 12.5 10.8 13 42 +12V_2_ SBEU SBEU +12 S Voltage V 11.5 12.5 11 13 43 -12V_ SBEU SBEU -12 T Voltage V -12.5 -10.8 -13 -10.3 44 +5V_Curr_ SBEU SBEU +5 Current A 0.45 0.6 .05 0.7 45 +12V_Curr _1_ SBEU SBEU +12 T Current A 0.125 0.5 .05 0.6 46 +12V_Curr _2_ SBEU SBEU +12 S Current A 0.7 0.8 0.25 0.85 47 -12V_Curr _ SBEU SBEU -12 Current A 0.125 0.2 0.05 .25 48 MM_GUNN_Curr MM Gunn Current mA 150 160 145 165 49 SMM_Mult_Curr SMM Multiplier Current mA 0 3 0 5 50 SMM_PLL_ERR Smm PLL Phase Error V 1.5 2.75 1.25 3.0 51 FS1_ERR FS1 Phase Error -2182 V 1.0 3.5 0.5 4.0 52 FS2_ERR FS2 Phase Error -7147 V 1.0 3.5 0.5 4.0 53 FS3_ERR FS3 Phase Error -7728 V 1.0 3.5 0.5 4.0 54 SMM_PLL_GUNN_Curr SMM Gunn Current mA 150 160 145 165 55 SMM_PLL_IF_PWR PLL IF Power V 8.2 9.3 8.0 9.5 Figure 4 MIRO Temperature Sensor Locations Text Box: APPENDIX B Ancillary Temperature Monitoring Table 4 Ancillary Temperature Monitoring, Instrument Power OFF Channel Thermocouple Name Units Yel_lo Yel_hi Red_lo Red_hi 1 Optical Bench C -25.0 +55.0 -28.0 +58.0 2 SBEU Electronics Interface C -25.0 +55.0 -28.0 +58.0 3 EU Electronics Interface C -25.0 +55.0 -28.0 +58.0 4 USO Interface C -25.0 +55.0 -28.0 +58.0 5 SBEU A1, Triple Supply * C -25.0 +55.0 -28.0 +58.0 6 SBEU A2, +12 Power Supply C -25.0 +55.0 -28.0 +58.0 7 SBEU U23, -5V Regulator C -25.0 +55.0 -28.0 +58.0 8 SBEU U5, Gunn Bias C -25.0 +55.0 -28.0 +58.0 9 SBEU U8, LNA Bias C -25.0 +55.0 -28.0 +58.0 10 EU-A A1, 24V &5V Regulator C -25.0 +55.0 -28.0 +58.0 11 EU-A A2, +/-12V & 5V Regulator C -25.0 +55.0 -28.0 +58.0 12 mm RFE LNA C -25.0 +55.0 -28.0 +58.0 13 submm RFE LNA C -25.0 +55.0 -28.0 +58.0 Table 5 Ancillary Temperature Monitoring, Instrument Power ON Channel Thermocouple Name Units Yel_lo Yel_hi Red_lo Red_hi 1 Optical Bench C -15.0 +35.0 -18.0 +38.0 2 SBEU Electronics Interface C -15.0 +50.0 -18.0 +53.0 3 EU Electronics Interface C -15.0 +50.0 -18.0 +53.0 4 USO Interface C -15.0 +50.0 -18.0 +53.0 5 SBEU A1, Triple Supply * C -15.0 +90.0 -18.0 +100.0 6 SBEU A2, +12 Power Supply C -15.0 +90.0 -18.0 +100.0 7 SBEU U23, -5V Regulator C -15.0 +90.0 -18.0 +100.0 8 SBEU U5, Gunn Bias C -15.0 +90.0 -18.0 +100.0 9 SBEU U8, LNA Bias C -15.0 +90.0 -18.0 +100.0 10 EU-A A1, 24V &5V Regulator C -15.0 +90.0 -18.0 +100.0 11 EU-A A2, +/-12V & 5V Regulator C -15.0 +90.0 -18.0 +100.0 12 mm RFE LNA C -15.0 +45.0 -18.0 +55.0 13 submm RFE LNA C -15.0 +55.0 -18.0 +60.0 Figure 5 MIRO Ancillary Temperature Monitoring Points Text Box: Channels 12 - 13Text Box: Channels 5 - 9Text Box: Channels 10 - 11Text Box: Channel 3Text Box: Channel 4Text Box: Channel 2Text Box: Channel 1 APPENDIX C Environmental Test Facility Temperature Monitoring Table 6 Temperature Monitoring Points by the ETL Facility Channel Thermocouple Name Units Yel_lo Yel_hi Red_lo Red_hi 1 Large Thermal Plate C -100 80 -110 90 2 Small Thermal Plate C -100 80 -110 90 3 Cold Load Thermal Plate C -100 -50 -110 -40 4 Target Temp 1 (Center) C -25.0 +55.0 -30.0 +60.0 5 Target Temp 2 (UR Corner) C -25.0 +55.0 -30.0 +60.0 6 Target Temp 3 (UL Corner) C -25.0 +55.0 -30.0 +60.0 7 Target Temp 4 (LR Corner) C -25.0 +55.0 -30.0 +60.0 8 Target Temp 5 (LL Corner) C -25.0 +55.0 -30.0 +60.0 9 Optical Bench C -25.0 +55.0 -28.0 +58.0 10 SBEU Electronics Interface C -25.0 +55.0 -28.0 +58.0 11 EU Electronics Interface C -25.0 +55.0 -28.0 +58.0 12 USO Interface C -25.0 +55.0 -28.0 +58.0 Figure 6 Environmental Test Facility Temperature Monitoring Points Text Box: Chamber DoorText Box: Cold Load Thermal PlateText Box: Small Thermal PlateText Box: Large Thermal PlateText Box: Channel 7 - 8Text Box: Channel 5 - 6Text Box: Channel 4Text Box: Channel 3Text Box: Channel 2Text Box: Channel 1Text Box: Channel 11Text Box: Channel 12Text Box: Channel 10Text Box: Channel 9